Modular power distribution system and methods

ABSTRACT

A modular power distribution system comprises a chassis; and a backplane including a power input, and a plurality of module connection locations. A plurality of modules are mounted in the chassis, each module mounted to one of the module connection locations. Each module includes: (i) an OR-ing diode; (ii) a circuit protection device; (iii) a microprocessor controlling the circuit protection device; and (iv) a power output connection location. A circuit option switch is located on each module for setting the current limits for each module. A control module is provided connected to the backplane.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 11/654,367,filed Jan. 17, 2007, which claims the benefit of provisional applicationSer. No. 60/760,598, filed Jan. 20, 2006 and provisional applicationSer. No. 60/762,915, filed Jan. 27, 2006, which applications are herebyincorporated by reference in their entirety.

FIELD OF THE INVENTION

The present invention relates to a power distribution panel with circuitelement modules.

BACKGROUND OF THE INVENTION

Electrical circuit panels such as power distribution panels typicallyinclude a number of different circuit elements such as fuse holders andfuses, circuit breakers, input and output connectors and alarm signalLED's. For safety and other reasons, the electrical circuits of powerdistribution panels are enclosed within a housing structure. Therefore,the circuit elements listed above have typically been inserted intoholes that have been pre-cut or pre-punched into the housing structure,usually on a front or back panel of the housing structure.

These prior circuit panels are fixed and once the holes are formed inthe housing, the type and arrangement of the components is limited. Inorder to manufacture different fixed circuit panels of the priorsystems, a circuit panel manufacturer would punch out different patternsof holes in the front or back panels of the housing structure in orderto accommodate different arrangements of circuit elements. Significantretooling time and costs are involved for offering different fixedpanels. Assembly of the circuit elements is also difficult when theelements are inserted through holes. One solution is described and shownin U.S. Pat. No. 6,456,203.

In addition, such panels are hardwired between the input and outputconnections, and the fuse and/or breaker locations. In some panels,redundant power connections are provided, controlled by an OR-ing diodeincluding a heat sink. These features can take up significant spacewithin the panel.

There is a continued need for improved power distribution panels.

SUMMARY OF THE INVENTION

A modular power distribution system comprises a chassis; and a backplaneincluding a power input, and a plurality of module connection locations.A plurality of modules are mounted in the chassis, each module mountedto one of the module connection locations. Each module includes: (i) anOR-ing diode; (ii) a circuit protection device; (iii) a microprocessorcontrolling the circuit protection device; and (iv) a power outputconnection location. A circuit option switch is located on each modulefor setting the current limits for each module. A system control moduleis provided connected to the backplane.

A modular power distribution system comprises a chassis having an openfront and an interior; and a backplane positioned opposite to the openfront, and including a power input, and a plurality of module connectionlocations. A plurality of modules are mounted in the interior of thechassis, each module mounted to one of the module connection locations.Each module includes: (i) a rear connector; (ii) a main body; (iii) acircuit protection device; (iv) a front panel; and (v) a power outputconnection location on the front panel.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic side view of one embodiment of a powerdistribution panel, with a module partially inserted into the chassis.

FIG. 2 is a schematic side view of another embodiment of a powerdistribution panel, with a module partially inserted into the chassis.

FIG. 3 is a schematic top view of the power distribution panel of FIG.1.

FIG. 4 is a schematic top view of an alternative embodiment of a powerdistribution panel.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIGS. 1 and 2, power distribution systems 10, 110 areshown. Power distribution systems 10, 110 are modular designs includinga chassis 12 and removable circuit modules 14, 114. Each circuit module14, 114 includes an electronic breaker 16, 116 for circuit protection,and a port assembly 18, 118 for output power distribution.

Chassis 12 includes a top 34 and a bottom 36. A backplane 38, such as aprinted circuit board, provides the interconnection between modules 14,114 and power input connector 26. Preferably, a second (redundant) powerinput connector 27 is provided (see FIG. 3).

Modules 14, 114 are received in chassis 12 through a front opening 20.Modules 14, 114 can be removed through front opening 20 as desired torepair, replace or service the modules. Modules 14, 114 can be latchedor otherwise attached to chassis 12, as desired.

Modules 14, 114 are similar in many respects for distributing andmonitoring the power in systems 10, 110. Modules 14, 114 each include aprinted circuit board 42 with circuitry for linking the input power tothe output power. Modules 14, 114 differ in the arrangements for thepower outputs at port assemblies 18, 118. Module 10 includes a singlepower output connector 72, such as a high power connector including aDB9-2W2 connector; whereas module 110 includes a plurality of separatepower output connectors 172, such as lower power connectors includingscrew terminals.

The electronic breakers 16, 116 are part of active circuit modules 14,114 to replace discrete fuses and circuit breaker used in prior artpower distribution panels. The end user adds, removes, or upgrades portsin the power distribution system as required by adding or removingcircuit modules 14, 114.

Each circuit module 14, 114 can be used as a 1A, 2A, 10A, etc. breakerby setting current limit options switches 22. For example, 2 positionDIP switches could be used. Prior art panels with discrete fuses andbreakers have a single trip value. Control logic 24 includingmicrocontroller 28 monitors the output current via current sensors 30,130. If the output current exceeds the limits set by option switches 22,microcontroller 28 will turn-off (“trip”) a breaker device 32, which ispreferably a solid-state device. The current limit set by the optionswitches 22 can also be overridden via a software interface from aremote terminal through a control module 40 (see FIGS. 3 and 4).Microprocessor 28 is networked to an external processor through controlmodule 40. If a breaker device 32 is tripped due to the detection of anover current condition, microcontroller 28 will periodically re-enablebreaker device 32 to see if the fault still exists. This can eliminate aservice visit if the over current was caused by a momentary transientcondition.

Microcontroller 28 provides control over breaker device 32. Thiseliminates disconnects caused by source or load transients.Microcontroller 28 can also set a breaker trip point based on loadmonitoring over time. Microcontroller 28 is also equipped with a historyfile that records various conditions local to the individual circuitmodules 14, 114. This information is accessible via the control module40.

Microprocessor 28 can include a load dependent trip control algorithm.This option allows microprocessor 28 to set the breaker trip point for agiven load based on a learning algorithm. Microprocessor 28 monitorsoutgoing current over time (can be a user selectable time period).Microprocessor 28 is configured to calculate a margin of error, then usethe new value to create a trip value for each circuit module 14, 114.For example, one circuit module 14 is used in a 30 amp circuit. However,typically the circuit only draws a 27 amp load. Mircroprocessor 28recognizes the 27 amp load by monitoring the current load over time,then adds a margin of error (e.g., 1%-5%) to create a load dependenttrip value. Therefore, the circuit will trip before 30 amps is everdrawn. Such a system prevents over fusing, and damaged equipment.

Low voltage disconnect (LVD) is localized to the circuit modules 14,114. Under voltage conditions are monitored by microcontroller 28 withan under voltage sensor 46. If the voltage drops below the recommendedlevel, microcontroller 28 will turn breaker device 32 off to disconnectthe load. The same process will occur if an over voltage conditionoccurs. Over voltage conditions are monitored by microcontroller 28 withan over voltage sensor 48.

To support redundant (dual feed) applications, the OR-ing diodes 54 arelocalized to the individual circuit modules 14, 114. Prior art powerdistribution panels that used OR-ing diodes placed them in the inputcircuits which required very large diodes and heat sinks and created asingle point of failure for the system. The arrangement of systems 10,110 allows the heat dissipated by the OR-ing diodes 54 to be evenlydistributed in chassis 12 preventing a localized hot spot. The notedarrangement also reduces the size of the diodes and their respectiveheat sinks, and eliminates the single point of failure common in priorart power distribution panels. Circuit modules 14, 114 can also includea temperature sensor 50 for monitoring high temperature conditions.

An LED indicator 62 on each circuit module 14, 114 provides a visualstatus of input and output voltage, output current, temperature,over/under voltage conditions, and breaker trip. A local reset switch 68is also provided to reset the breaker device 32 after a trip conditionhas occurred.

In circuit module 14, all input and output to the electronic breaker 16is via a high current connector 18 to prevent accidental contact byservice personnel. Circuit module 14 includes a front connector 72, anda rear connector 76. Front connector 72 connects to cable connector 82and cable 86 for the output power. Rear connector 76 connects to chassisbackplane connector 84 for input power to module 14. The high powerconnector also prevents polarity reversals.

Front connectors 172 of circuit module 114 each connect to a poweroutput connector 182 and cable 186. Power output connector 182 may be alug for screw connection to front connector 172.

Systems 10, 110 eliminate internal wiring normally required in prior artpower distribution panels. All power and signaling is confined to PCBtraces, planes, and bus bars, which improves reliability and reducesassembly cost. Chassis 12 is a passive component that can bereconfigured for a variety of applications. Systems 10, 110 also reducethe number of connections and thermal loss associated with eachconnection.

All circuit modules 14, 114 in chassis 12 communicate with controlmodule 40. Control module 40 provides access to systems 10, 110 via alaptop serial or network connection for status and alarm information.Control module 40 also provides the external alarms signals common inTelco application. Access to control module 40 is through a frontconnector 56, or through a rear connector 58 on a back of backplane 38.

Chassis 12 in FIG. 3 has rear input power connectors 26, 27, and frontaccessible circuit modules 14. A modified chassis 112 in system 10′ asshown in FIG. 4 includes front accessible input power connectors 126,127.

Circuit modules 14, 114 and control module 40 can be provided with frontface plates 86 to protect the interior circuit features. Ventilationholes 88 can be added through front face plates 86, to allow for airflowthrough systems 10, 10′, 110 for cooling of system components.

The above noted panels include modular arrangements for the individualor groupings of circuits. Additional modules can be added as additionalcircuits are added to the system. By utilizing localized OR-ing, smallerdiodes and smaller heat sinks can be used. Additional advantages arisefrom the localized components associated with each module. Inparticular, with a localized low voltage disconnect elements, there isno need for a large low voltage disconnect contactors associated with adedicated panel. Local LED indicators show indicators for each moduleallowing for improved diagnostics.

1. A modular power distribution system comprising: (a) a chassis; (b) abackplane including a plurality of module connection locations; (c) aplurality of modules mounted in the chassis, each module mounted to amodule connection location and at least one of the plurality of modulesincluding: (i) a circuit protection device operable at a plurality ofselectable trip levels; (ii) a microprocessor controlling the circuitprotection device; (iii) an OR-ing diode; and (iv) a power outputconnection location.
 2. The modular power distribution system of claim1, further comprising a power input electrically connected to thebackplane.
 3. The modular power distribution system of claim 1, furthercomprising a circuit option switch located on at least one of theplurality of modules.
 4. The modular power distribution system of claim1, wherein at least one of the plurality of modules further includes alow voltage disconnection circuit.
 5. The modular power distributionsystem of claim 1, wherein the circuit protection device includes asolid state circuit breaker.
 6. The modular power distribution system ofclaim 5, wherein, if the circuit breaker is in a tripped state, themicroprocessor is configured to periodically re-enable the solid statecircuit breaker.
 7. The modular power distribution system of claim 1,wherein the microprocessor provides load dependent trip control of thecircuit protection device.
 8. The modular power distribution system ofclaim 1, wherein the microprocessor is configured to monitor a currentover a period of time.
 9. The modular power distribution system of claim1, wherein the at least one of the plurality of modules further includesa circuit option switch, the circuit option switch including a DIPswitch communicatively connected to the microprocessor.
 10. A method ofdistributing power using a modular power distribution system, the methodcomprising: distributing power through a plurality of modules mounted toa chassis, the chassis having an open front and a backplane, wherein:(i) each module slides into an open front of the chassis; (ii) eachmodule connects to the backplane to provide each module with inputpower; (iii) each module includes an OR-ing diode and a circuitprotection device operable at a plurality of selectable trip levels, thecircuit protection device controlled by a microprocessor; (iv) eachmodule provides output power along a front panel of each module,protected by the circuit protection device of each module; uponoccurrence of a circuit protection event in one of the plurality ofmodules, tripping the circuit protection device in that module at a triplevel selected from the plurality of selectable trip levels.
 11. Themethod of claim 10, wherein the trip level is selected by amicroprocessor included within the module.
 12. The method of claim 11,further comprising executing a learning algorithm in the microprocessorto set the trip level.
 13. The method of claim 10, wherein the circuitprotection event is selected from the group consisting of: detecting anundervoltage condition; detecting an overvoltage condition detecting ahigh temperature condition; and detecting an overcurrent condition. 14.The method of claim 10, further comprising setting the trip level of thecircuit protection device based on a signal received from a remoteterminal.
 15. The method of claim 10, further comprising setting thetrip level of the circuit protection device based on one or more optionswitches located on the module.
 16. The method of claim 10, furthercomprising, after tripping the circuit protection device, periodicallyre-enabling the circuit protection device by the microprocessor todetermine the existence of the condition causing the circuit protectionevent.
 17. The method of claim 15, wherein the one or more optionswitches include one or more DIP switches.
 18. A modular powerdistribution system comprising: (a) a chassis; (b) a backplane withinthe chassis and including a plurality of module connection locations;(c) a plurality of modules mounted in the chassis, each module mountedto a module connection location and including: (i) an OR-ing diode; (ii)a low voltage disconnect circuit; (ii) a circuit protection deviceoperable at a plurality of selectable trip levels; and (iii) a poweroutput connection location; and (d) a microprocessor configured toselect a trip level from among the plurality of selectable trip levels.